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MediaTek will launch next-generation Dimensity chipsets in China next week. The Taiwanese semiconductor maker announced the debut of new chips via its social media profile, but did not divulge their names. The rumored Dimensity 8400 SoC from MediaTek, which will succeed last year's Dimensity 8300 SoC, is likely to make its debut during the launch event. The reported 4nm device might have a 1+3+4 design. It is believed to have scored over 1.8 million points on AnTuTu benchmarks.
In a Weibo post, MediaTek revealed that its next-generation Dimensity chips would be available on December 23 at 03:00pm. The brand did not reveal the precise name of the next chipsets, but based on previous rumors, we may assume one of them to be the Dimensity 8400 SoC.
MediaTek Dimensity 8400 Specifications (Expected)
MediaTek is likely to release the Dimensity 8400 SoC as the successor to the Dimensity 8300 SoC. The next octa-core CPU, produced utilizing TSMC's 4nm technology, is said to sport a 1+3+4 architecture. It might feature the Immortalis-G720 MC7 GPU, which is believed to have earned more than 1.8 million points on AnTuTu benchmarks.
The Dimensity 8400 SoC is expected to include one prime CPU core clocked at 3.25GHz, three cores capped at 3.0GHz, and four cores limited at 2.1GHz. It is likely to compete with Qualcomm's Snapdragon 8 Gen 3 chipset.
OEMs are anticipated to include the Dimensity 8400 SoC in smartphones at a starting price of CNY 1,500 (approximately Rs 17,250). The Redmi Turbo 4 is expected to be the first smartphone to include the Dimensity 8400 processor. It is expected to become official in China in January next year. The device might be marketed in areas other than China under the name Poco X7.
The anticipated Oppo Find X8S and Redmi K80E are also said to operate on the MediaTek Dimensity 8400 processor.
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